High Speed Designs
DDR 3 Chip-on-Board High Speed Routing
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Scope of Work:
Services Provided:
DDR3 Memory Chip-on-Board
.8mm mirrored BGA's
10 Layer HDI Tech
Laser Via-In-Pad Technology
Multiple Impedance Stack-up, differential and single-ended.
High Power Switcher on Board
Printed Circuit Board Design
Power distribution calculations
Impedance stack-up calculations
Rules driven routing and verification