• | DDR3 Memory Chip-on-Board |
• | .8mm mirrored BGA's |
• | 10 Layer HDI Tech |
• | Laser Via-In-Pad Technology |
• | Multiple Impedance Stack-up, differential and single-ended. |
• | High Power Switcher on Board |
• | Printed Circuit Board Design |
• | Power distribution calculations |
• | Impedance stack-up calculations |
• | Rules driven routing and verification |