• | DDR3 High Speed Technology |
• | 244 pin Memory DIMM's |
• | 22 Layer Blind and buried Vias |
• | Signal Speed of 1.6 Mb/s |
• | Multiple Impedance Stack-up |
• | High Power Switcher on Board |
• | Printed Circuit Board Design |
• | Power distribution calculations |
• | Impedance stack-up calculations |
• | Rules driven routing and verification |